Learning outcomes

On successful completion of

this unit a learner will:

Assessment criteria for pass

The learner can:

LO1 Understand the production

and packaging of solid-state

electronic devices

1.1 describe the production of solid-state devices common

to the electronics industry

1.2 evaluate the different types of device packaging

Available

LO2 Understand electronic

component design

parameters

2.1 explain the effects of altering given design rules on

microelectronic devices

2.2 explain failure modes and mechanisms for a range of

microelectronic devices

LO3 Understand the methods

used for the design,

simulation, manufacture and

testing of printed circuit

boards (PCB)

3.1 explain the design and simulation of single- and multilayer

PCBs

3.2 specify the types of equipment required for automated

PCB manufacture and assembly

3.3 explain the methods of testing completed PCBs and

finished electronic products

3.4 explain the methods of designing and producing casings

and housings for electronic products

LO4 Understand the key

elements of an automated

PCB assembly facility

4.1 describe the key elements of an automated PCB

assembly facility

4.2 evaluate the use of robots for components placement

including selection criteria and associated costs.